IPC-7351B-Naming-Convention

    
© 2010 IPC and Mentor Graphics 07/12/10

Full Document

1) Chip Capacitors, Resistors and Inductors (RES, CAP and IND) – Pin 1 (Positive) on Left
2) Molded Inductors (INDM), Resistors (RESM), Molded Polarized Capacitors (CAPMP) – Pin 1 (Positive) on Left
3) Precision Wire-wound Inductors – Pin 1 (Positive) on Left
4) MELF Diode – Pin 1 (Cathode) on Left
5) SOD Diodes – Pin 1 (Cathode) on Left
6) Aluminum Electrolytic Capacitors – Pin 1 (Positive) on Left
7) SOT Devices (SOT23, SOT23-5, SOT223, SOT89, SOT143, etc.) – Pin 1 Upper Left
8) TO252 & TO263 (DPAK Type) Devices – Pin 1 Upper Left
9) Small Outline Gullwing ICs (SOIC, SOP, TSOP, SSOP, TSSOP) – Pin 1 Upper Left
10) Ceramic Flat Packs (CFP) – Pin 1 Upper Left
11) Small Outline J Lead ICs (SOJ) – Pin 1 Upper Left
12) Quad Flat Pack ICs (PQFP, SQFP) – Pin 1 Upper Left
13) Ceramic Quad Flat Packs (CQFP) – Pin 1 Upper Left
14) Bumper and Plastic Quad Flat Pack ICs (BQFPC, PQFPC Pin 1 Center) – Pin 1 Top Center
15) Plastic Leaded Chip Carriers (PLCC) – Pin 1 Top Center
16) Leadless Chip Carriers (LCC) – Pin 1 Top Center
17) Leadless Chip Carriers (LCCS Pin 1 on Side) – Pin 1 Upper Left
18) Quad Flat No-Lead ICs (QFN) QFNS & QFNRV, QFNRH – Pin 1 Upper Left
19) Ball Grid Arrays (BGA) – Pin A1 Upper Left

Books:

> IPC-A-610 revision D (version française) acceptabilité des assemblages électroniques (format imprimé)
> Date de parution: 03-2006
> Langue : FRANÇAIS
>
> Le prix indicatif serait de l'ordre de 325.- et le délai de livraison estimé de l'ordre de 3-4 semaines.