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Erni 1.27mm
Advanced technology:
3D-MID technology -> 3 dimensional circuits or molded interconnect
Values should always be of series E12 or E24. This is specially important for projects that will be assembled by machine. Value Calculator that helps you to find the best combination for voltage deviders.
http://www.multi-circuit-boards.eu/en/pcb-design-aid/design-parameters.html
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Name
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Min. dimensions
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A, B, C
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via, buried via
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aspect ratio
final diameter
via pad
annular ring
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1:20
100µm
300µm
100µm (enclosing)
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D
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blind via, mechanical
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max. Ø
400µm
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aspect ratio
final diameter
via pad
annular ring
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1:1
100µm
400µm
150µm (enclosing)
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E
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blind via, laser
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aspect ratio
final diameter
via pad
annular ring
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1:1
75µm
225µm
75µm* (enclosing)
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F
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stacked via
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aspect ratio
final diameter
via pad
annular ring
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1:1 - 1:12 **
100µm
300µm
100µm
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G
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staggered via
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aspect ratio
final diameter
via pad
annular ring
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1:1 - 1:12 **
100µm
300µm
100µm
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H, I
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conductor traces (outer, inner) -
see Conductor / Copper Thickness
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width
spacing
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60µm
60µm
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J
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conductor / pad to milling edge
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spacing
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200µm
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K
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conductor / pad to via
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spacing
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200µm
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L
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solder-stop coating
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spacing
bridge width
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50µm (enclosing)
100µm
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* Annular ring depends on copper thickness! Please ask for critical designs.
** Aspekt ratio depends on Ø. 100µm 1:1, >100µm 1:4, >150µm 1:10, >200µm 1:12
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Part and Pin Swapping
Dynamic Net Assignment (Altium only)
Dynamic Net Assignment is the ability to adopt a hierarchical and iterative routing strategy, escape routing devices first, then routing to the edge of a given area, and then finally connecting these sections together.
Multi-part and single part symbols for the same type of quad resistor array.
